US 12,464,932 B2
Display substrate and preparation method therefor, and display panel
Qiuhua Meng, Beijing (CN); Xueyan Tian, Beijing (CN); and Yueping Zuo, Beijing (CN)
Assigned to Beijing BOE Technology Development Co., Ltd., Beijing (CN)
Appl. No. 17/913,778
Filed by BOE Technology Group Co., Ltd., Beijing (CN)
PCT Filed Feb. 2, 2021, PCT No. PCT/CN2021/074947
§ 371(c)(1), (2) Date Sep. 22, 2022,
PCT Pub. No. WO2021/190162, PCT Pub. Date Sep. 30, 2021.
Claims priority of application No. 202010217464.3 (CN), filed on Mar. 25, 2020.
Prior Publication US 2024/0215393 A1, Jun. 27, 2024
Int. Cl. H10K 59/80 (2023.01); H10K 59/12 (2023.01); H10K 59/131 (2023.01); H10K 71/20 (2023.01); H10K 102/00 (2023.01)
CPC H10K 59/873 (2023.02) [H10K 59/1201 (2023.02); H10K 59/131 (2023.02); H10K 71/20 (2023.02); H10K 2102/311 (2023.02); H10K 2102/351 (2023.02)] 19 Claims
OG exemplary drawing
 
1. A display substrate, comprising:
a base substrate, provided with a display area and a non-display area surrounding the display area;
a gate layer on the base substrate;
an interlayer insulation layer on a side of the gate layer away from the base substrate, comprising a first organic insulation layer and a first inorganic insulation layer, wherein the first organic insulation layer covers the display area and part of the non-display area;
a source and drain layer on a side of the interlayer insulation layer away from the base substrate; and
an encapsulation layer, covering the display area and part of the non-display area;
wherein the non-display area comprises a fan routing wire area and a bonding area on a first side of the display area, and a gate driving circuit area on at least one side of two opposite sides of the display area, and the two opposite sides are adjacent to the first side; and
the first organic insulation layer covers the gate driving circuit area, and an orthographic projection of the first organic insulation layer on the base substrate does not overlap with the bonding area; and
the encapsulation layer does not cover the bonding area.