US 12,464,913 B2
Display apparatus and manufacturing method thereof
Jiafan Shi, Beijing (CN); Xuewei Tian, Beijing (CN); Changchang Liu, Beijing (CN); Yuanzheng Guo, Beijing (CN); Xiaoqi Ding, Beijing (CN); and Liqiang Chen, Beijing (CN)
Assigned to Chengdu BOE Optoelectronics Technology Co., Ltd., Sichuan (CN); and Beijing BOE Technology Development Co., Ltd., Beijing (CN)
Appl. No. 18/025,385
Filed by Chengdu BOE Optoelectronics Technology Co., Ltd., Sichuan (CN); and BOE Technology Group Co., Ltd., Beijing (CN)
PCT Filed Jun. 30, 2022, PCT No. PCT/CN2022/102871
§ 371(c)(1), (2) Date Mar. 8, 2023,
PCT Pub. No. WO2024/000422, PCT Pub. Date Jan. 4, 2024.
Prior Publication US 2024/0298483 A1, Sep. 5, 2024
Int. Cl. H10K 59/131 (2023.01); H10K 59/12 (2023.01); H10K 59/90 (2023.01); H10K 102/00 (2023.01)
CPC H10K 59/131 (2023.02) [H10K 59/1201 (2023.02); H10K 59/90 (2023.02); H10K 2102/311 (2023.02)] 15 Claims
OG exemplary drawing
 
1. A display apparatus, comprising:
a driving chip;
a flexible circuit board; and
a display panel;
wherein
the display panel has a display portion and a bonding portion on one side of the display portion;
the bonding portion comprises a first bending portion, a first connection portion, a second bending portion and a second connection portion which are sequentially arranged in a direction with an increasing extending distance from the display portion; wherein
the first connection portion is disposed on a back face of the display portion;
the second connection portion is disposed on a side of the first connection portion facing away from the display portion;
the driving chip is in bonding connection with the display panel in the first connection portion;
the flexible circuit board is in bonding connection with the display panel in the second connection portion;
the driving chip is disposed on a side of the first connection portion facing away from the display portion; and
the flexible circuit board is disposed on a side of the driving chip facing away from the display portion;
the display panel comprises:
a flexible substrate; and
at least one insulating layer and at least one metal layer which are disposed on the flexible substrate;
wherein
the at least one insulating layer and the at least one metal layer both have no pattern in the first bending portion and the second bending portion;
the flexible substrate comprises a first flexible substrate layer, a base metal layer and a second flexible substrate layer which are sequentially disposed in stack; and
the at least one metal layer is coupled with the base metal layer through a via hole running through the at least one insulating layer.