US 12,464,911 B2
Flexible substrate and electronic device
Takumi Sano, Tokyo (JP)
Assigned to Magnolia White Corporation, Tokyo (JP)
Filed by Magnolia White Corporation, Tokyo (JP)
Filed on Jun. 22, 2022, as Appl. No. 17/846,619.
Application 17/846,619 is a continuation of application No. PCT/JP2020/039174, filed on Oct. 16, 2020.
Claims priority of application No. 2019-236284 (JP), filed on Dec. 26, 2019.
Prior Publication US 2022/0320259 A1, Oct. 6, 2022
Int. Cl. H01L 27/32 (2006.01); H10K 59/131 (2023.01); H10K 77/10 (2023.01)
CPC H10K 59/131 (2023.02) [H10K 77/111 (2023.02)] 1 Claim
OG exemplary drawing
 
1. An electronic device comprising:
a flexible substrate; and
a wiring substrate,
the flexible substrate comprising:
a first insulating basement including an island-shaped portion, a bridge portion, and an extending portion; and
a routing line provided on the first insulating basement and extending in a second direction,
the island-shaped portion including a first island-shaped portion and a second island-shaped portion disposed parallel to the first island-shaped portion in a first direction,
the bridge portion extending in the first direction and connecting the first island-shaped portion with the second island-shaped portion,
the extending portion including a first extending portion which is connected to the first island-shaped portion and extends in the second direction intersecting the first direction, and a second extending portion which is connected to the bridge portion and extends in the second direction,
the first insulating basement including a peripheral portion,
the first extending portion being connected to the peripheral portion,
the peripheral portion being a terminal portion,
the routing line being provided on the first extending portion and connected to a pad formed on the terminal portion,
the wiring substrate being mounted on the terminal portion,
the wiring substrate including a second insulating basement, a lead line, and a second pad electrically connected to the lead line,
the flexible substrate and the wiring substrate being connected to each other via a connecting material, and
the second insulating basement being formed of a material having a lower coefficient of elasticity than the first insulating basement.