US 12,464,889 B2
Light-emitting device and method for manufacturing light-emitting device
Akihiro Chida, Kanagawa (JP); and Tomoya Aoyama, Kanagawa (JP)
Assigned to Semiconductor Energy Laboratory Co., Ltd., (JP)
Filed by Semiconductor Energy Laboratory Co., Ltd., Kanagawa-ken (JP)
Filed on Jun. 2, 2022, as Appl. No. 17/830,533.
Application 15/707,383 is a division of application No. 14/476,154, filed on Sep. 3, 2014, granted, now 9,773,998, issued on Sep. 26, 2017.
Application 17/830,533 is a continuation of application No. 16/900,034, filed on Jun. 12, 2020, granted, now 11,355,729.
Application 16/900,034 is a continuation of application No. 15/707,383, filed on Sep. 18, 2017, granted, now 10,686,157, issued on Jun. 16, 2020.
Claims priority of application No. 2013-184698 (JP), filed on Sep. 6, 2013; and application No. 2013-218601 (JP), filed on Oct. 21, 2013.
Prior Publication US 2022/0302411 A1, Sep. 22, 2022
Int. Cl. H10K 50/842 (2023.01); H10K 77/10 (2023.01)
CPC H10K 50/8426 (2023.02) [H10K 77/111 (2023.02)] 2 Claims
OG exemplary drawing
 
1. A light-emitting device comprising:
a first flexible substrate;
a light-emitting element over the first flexible substrate;
a first bonding layer over the light-emitting element;
two second bonding layers arranged so as to be in contact with the first bonding layer; and
a second flexible substrate over the first bonding layer and the two second bonding layers,
wherein an oxygen permeability of the two second bonding layers is lower than an oxygen permeability of the first bonding layer, and
wherein the two second bonding layers are spaced apart from each other.