US 12,464,873 B2
Display device, method of fabricating the same, and tiled display device including a plurality of display devices
Nak Cho Choi, Yongin-si (KR); Sang Woo An, Asan-si (KR); Yong Duck Son, Seongnam-si (KR); Won Ho Jang, Hwaseong-si (KR); and Myung Koo Hur, Asan-si (KR)
Assigned to Samsung Display Co., Ltd., Yongin-si (KR)
Filed by Samsung Display Co., LTD., Yongin-si (KR)
Filed on Oct. 20, 2022, as Appl. No. 17/970,406.
Claims priority of application No. 10-2022-0012657 (KR), filed on Jan. 27, 2022.
Prior Publication US 2023/0238494 A1, Jul. 27, 2023
Int. Cl. H10H 20/857 (2025.01); G09F 9/302 (2006.01); G09F 9/33 (2006.01); H01L 25/075 (2006.01); H10H 20/01 (2025.01)
CPC H10H 20/857 (2025.01) [G09F 9/3026 (2013.01); G09F 9/33 (2013.01); H01L 25/0753 (2013.01); H10H 20/0364 (2025.01)] 9 Claims
OG exemplary drawing
 
1. A display device comprising:
a substrate comprising a first surface, a second surface opposite the first surface, a first chamfered surface extending from a side of the first surface, a second chamfered surface extending from a side of the second surface, and a first side surface connecting the first chamfered surface and the second chamfered surface;
a plurality of subpixels on the first surface of the substrate and respectively comprising inorganic light emitting elements configured to emit light;
a side wiring on the first surface, the first chamfered surface, the first side surface, the second chamfered surface, and the second surface of the substrate; and
a circuit board on the second surface of the substrate and electrically connected to the side wiring,
wherein the side wiring comprises a first portion on the first surface of the substrate and a second portion on the first side surface of the substrate, and
wherein the side wiring comprises metal particles and a packing density of the metal particles of the first portion is higher than a packing density of the metal particles of the second portion.