| CPC H10H 20/8514 (2025.01) [H01L 25/0753 (2013.01); H10H 20/0361 (2025.01)] | 12 Claims |

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1. A method for manufacturing an optoelectronic device, which includes:
an array of diodes, having mutually opposite rear and front faces, the front face being configured to receive or transmit light radiation;
an array of colour conversion portions disposed on the front face, including first colour conversion portions disposed facing first diodes of the array of diodes;
the method including the following steps:
providing an optoelectronic structure including:
the array of first diodes;
at least one lower electrode layer disposed at the rear face and configured to polarise the diodes; and
upper electrode layers disposed at the front face and configured to polarise corresponding ones of the diodes, including first upper electrode layers configured to polarise the first diodes and distinct from other ones of the upper electrode layers;
depositing a dielectric layer, of which an upper face opposite the front face has a substantially zero surface potential, covering the array of diodes and the upper electrode layers;
applying a potential difference between a first temporary electrode disposed on the dielectric layer and the first upper electrode layers, resulting in formation of first patterns with non-zero surface potential in the dielectric layer located only facing the first upper electrode layers; then removing the first temporary electrode; and
producing the first colour conversion portions, by contacting the dielectric layer with a first colloidal solution containing first photoluminescent particles, which are deposited on the dielectric layer only facing the first patterns with non-zero surface potential, thus forming the first colour conversion portions.
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