US 12,464,870 B2
Sealing structures for light-emitting diode packages
Tucker McFarlane, Cary, NC (US); Robert Wilcox, Rolesville, NC (US); David Suich, Durham, NC (US); Thomas Celano, Cary, NC (US); Michael Check, Holly Springs, NC (US); and Colin Blakely, Raleigh, NC (US)
Assigned to CreeLED, Inc., Durham, NC (US)
Filed by CreeLED, Inc., Durham, NC (US)
Filed on Aug. 24, 2022, as Appl. No. 17/821,881.
Prior Publication US 2024/0072212 A1, Feb. 29, 2024
Int. Cl. H01L 33/48 (2010.01); H10H 20/85 (2025.01); H10H 20/853 (2025.01); H10H 20/855 (2025.01); H10H 20/825 (2025.01)
CPC H10H 20/8506 (2025.01) [H10H 20/853 (2025.01); H10H 20/855 (2025.01); H10H 20/825 (2025.01)] 22 Claims
OG exemplary drawing
 
1. A light-emitting diode (LED) package comprising:
a submount comprising a first side and a second side that opposes the first side;
at least one LED chip on the first side of the submount;
a cover structure arranged over the at least one LED chip, the cover structure being attached to the submount to form a first seal between the cover structure and the submount, the first seal being a first hermetic seal; and
a second seal on the LED chip and on a surface of the submount that is adjacent the LED chip, the second seal comprising inorganic materials, the first seal being attached to a first portion of the submount that is outside an area of the second seal on the surface of the submount.