| CPC H10H 20/814 (2025.01) [H10H 20/01335 (2025.01); H10H 20/81 (2025.01); H10H 20/825 (2025.01); H10H 20/833 (2025.01); H10H 20/851 (2025.01); H10H 20/857 (2025.01); H10H 20/032 (2025.01); H10H 20/0361 (2025.01); H10H 20/0364 (2025.01)] | 25 Claims |
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1. A method for manufacturing an image display device, the method comprising:
preparing at least one structure comprising a semiconductor layer formed on a first substrate, the semiconductor layer including a light-emitting layer;
bonding the semiconductor layer to a first surface of a second substrate;
removing the first substrate;
forming a light-emitting element by etching the semiconductor layer, the light-emitting element including a bottom surface on the first surface, and a light-emitting surface located opposite to the bottom surface;
forming a first insulating film that covers the first surface and the light-emitting element;
forming a circuit element on the first insulating film;
forming a second insulating film that covers the circuit element and the first insulating film;
exposing a surface that includes the light-emitting surface by removing a portion of the first insulating film and a portion of the second insulating film;
forming a via that extends through the first and second insulating films; and
forming a wiring layer on the second insulating film, wherein
the light-emitting element comprises a connection part formed on the first surface, and
the via is located between the wiring layer and the connection part and electrically connects the wiring layer and the connection part.
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