	US 12,464,857 B2
	Transfer resin for transferring an LED chip, and an apparatus for transferring an LED chip by using the same
Jae Sik Min, Yongin-si (KR); Jae Yeop Lee, Yongin-si (KR); Jae Suk Park, Yongin-si (KR); and Byoung Gu Cho, Yongin-si (KR)
Assigned to AGASemicon Corp., Yongin-si (KR)
Filed by AGASemicon Corp., Yongin-si (KR)
Filed on Feb. 7, 2022, as Appl. No. 17/666,218.
Claims priority of application No. 10-2021-0017708 (KR), filed on Feb. 8, 2021; and application No. 10-2021-0017715 (KR), filed on Feb. 8, 2021.
Prior Publication US 2022/0254949 A1, Aug. 11, 2022
Int. Cl. H10H 20/01 (2025.01); H01L 21/683 (2006.01); H01L 25/075 (2006.01)

CPC H10H 20/01 (2025.01) [H01L 21/6835 (2013.01); H01L 25/0753 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68386 (2013.01)]

17 Claims

1. A resin for transferring an LED chip, which is prepared by mixing a base resin, an organic solvent, and a photoactive agent, and to transfer an LED chip to a substrate by making adhesive force of the LED chip adhered to the resin to be broken or offset by expanding the resin by heating after exposure by using expandability of the photoactive agent, wherein the transfer resin further includes a solvent, the base resin is 30 to 35 wt %, the organic solvent is 45 to 50 wt %, the solvent is 5 to 10 wt %, and the photoactive agent is 10 to 15 wt %.