| CPC H10F 39/8063 (2025.01) [H04N 23/10 (2023.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H04N 25/10 (2023.01); H04N 25/79 (2023.01); H10F 39/024 (2025.01); H10F 39/026 (2025.01); H10F 39/8053 (2025.01); H10F 39/8057 (2025.01); H10F 39/809 (2025.01); H04N 25/76 (2023.01); H04N 25/773 (2023.01)] | 20 Claims |

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1. A manufacturing method for an image sensor, comprising:
providing a substrate;
forming a lens layer above the substrate;
forming a patterned hard mask layer on the lens layer;
etching the lens layer to transfer a pattern of the patterned hard mask layer to the lens layer such that a plurality of lenses are defined, wherein the lenses are micro-lenses or meta-surface lenses;
forming a cladding layer to cover the plurality of lenses and the substrate;
etching portions of the cladding layer to form a first inclined sidewall and a second inclined sidewall, wherein the first inclined sidewall is above the second inclined sidewall, wherein a projection of the first inclined sidewall on the substrate is spaced apart from a projection of the second inclined sidewall on the substrate; and
conformally forming a bandpass filter layer having multiple films on the cladding layer and covering the substrate.
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