US 12,464,840 B2
Solid-state imaging device and electronic device
Michiko Sakamoto, Kanagawa (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Filed on Jun. 18, 2024, as Appl. No. 18/746,728.
Application 18/746,728 is a continuation of application No. 17/996,850, granted, now 12,068,347, previously published as PCT/JP2021/008486, filed on Mar. 4, 2021.
Claims priority of application No. 2020-079022 (JP), filed on Apr. 28, 2020.
Prior Publication US 2024/0339470 A1, Oct. 10, 2024
Int. Cl. H10F 39/00 (2025.01); H10F 39/12 (2025.01)
CPC H10F 39/8053 (2025.01) [H10F 39/199 (2025.01); H10F 39/8063 (2025.01)] 20 Claims
OG exemplary drawing
 
1. An imaging device, comprising:
a semiconductor substrate having a first surface that receives a light and a second surface opposite to the first surface;
a plurality of photoelectric conversion parts disposed in the semiconductor substrate;
a plurality of color filters disposed over the first surface of the semiconductor substrate, wherein each color filter of the plurality of color filters corresponding to the each of the plurality of photoelectric conversion parts; and
a plurality of waveguide wall parts disposed over the first surface of the semiconductor substrate, the plurality of waveguide wall parts guiding the light to the corresponded photoelectric conversion parts,
wherein each of the plurality of waveguide wall parts is formed in a position subjected to pupil correction.