US 12,464,712 B2
Electronic circuit device
Keiichi Honda, Kyoto (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Jun. 30, 2023, as Appl. No. 18/345,558.
Application 18/345,558 is a continuation of application No. PCT/JP2021/047662, filed on Dec. 22, 2021.
Claims priority of application No. 2021-000919 (JP), filed on Jan. 6, 2021.
Prior Publication US 2023/0354593 A1, Nov. 2, 2023
Int. Cl. H10B 20/25 (2023.01); H01L 23/528 (2006.01); H01L 23/66 (2006.01)
CPC H10B 20/25 (2023.02) [H01L 23/528 (2013.01); H01L 23/66 (2013.01); H01L 2223/6605 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An electronic circuit device, comprising:
a semiconductor substrate;
a wiring layer on a surface of the semiconductor substrate; and
an external connection terminal on an outside surface of the wiring layer opposite the semiconductor substrate,
wherein the semiconductor substrate comprises:
a memory that is a write-once memory,
a controller configured to write and read data to and from the memory, and
a communication controller configured to control external data communication with the controller,
wherein the wiring layer comprises:
a first wiring conductor that connects the communication controller and the external connection terminal, and
a plane conductor between the first wiring conductor and the surface of the semiconductor substrate,
wherein the first wiring conductor overlaps the memory in a plan view of the semiconductor substrate, and
wherein the plane conductor is between the first wiring conductor and the memory, and is connected to a fixed electrical potential.