US 12,464,698 B2
Semiconductor device and method of fabricating the same
Eunsuk Choi, Suwon-si (KR); Yeram Kim, Suwon-si (KR); Siwoo Kim, Suwon-si (KR); Jinah Kim, Suwon-si (KR); Hyongsoo Kim, Suwon-si (KR); and Seonbaek Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Mar. 24, 2023, as Appl. No. 18/125,776.
Claims priority of application No. 10-2022-0115000 (KR), filed on Sep. 13, 2022.
Prior Publication US 2024/0090192 A1, Mar. 14, 2024
Int. Cl. H10B 12/00 (2023.01); H10D 1/68 (2025.01)
CPC H10B 12/033 (2023.02) [H10B 12/315 (2023.02); H10B 12/482 (2023.02); H10D 1/716 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
an active pattern;
a capacitor contact structure electrically connected to the active pattern; and
a capacitor structure electrically connected to the capacitor contact structure,
wherein the capacitor structure includes:
a first lower electrode and a second lower electrode, which are adjacent to each other;
a supporter supporting the first and second lower electrodes;
a capacitor insulating layer covering the first and second lower electrodes; and
an upper electrode on the capacitor insulating layer,
wherein the supporter includes a first supporter curved sidewall connected to the first lower electrode and the second lower electrode,
wherein the upper electrode includes an intervening electrode portion enclosed by the supporter, and
wherein the first supporter curved sidewall is convex toward the intervening electrode portion.