US 12,464,687 B2
Vehicle controller and vehicle having same
Axi Qi, Shenzhen (CN); Xingchun Zhang, Shenzhen (CN); Fengchuan Yu, Shenzhen (CN); and Qinghui Zeng, Shenzhen (CN)
Assigned to BYD Company Limited, Shenzhen (CN)
Filed by BYD COMPANY LIMITED, Guangdong (CN)
Filed on Sep. 26, 2023, as Appl. No. 18/373,239.
Application 18/373,239 is a continuation of application No. PCT/CN2022/084261, filed on Mar. 31, 2022.
Claims priority of application No. 202110679816.1 (CN), filed on Jun. 18, 2021.
Prior Publication US 2024/0023290 A1, Jan. 18, 2024
Int. Cl. H05K 7/20 (2006.01); H05K 5/02 (2006.01); H05K 5/03 (2006.01); H05K 9/00 (2006.01)
CPC H05K 7/20872 (2013.01) [H05K 5/0217 (2013.01); H05K 5/03 (2013.01); H05K 9/0007 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A vehicle controller, comprising:
a control box, the control box having a plate that has a first outer surface and a second outer surface disposed opposite to each other in a thickness direction of the control box, the first outer surface comprising a control cooling water channel, the control cooling water channel comprising an Insulated Gate Bipolar Transistor (IGBT) cooling layer, a power supply cooling layer, and a transition section, wherein the IGBT cooling layer and the power supply cooling layer are stacked in the thickness direction of the control box and communicated to each other via the transition section;
an IGBT module, the IGBT module being mounted on the first outer surface, and the IGBT module extending into the IGBT cooling layer and being cooled by coolant in the IGBT cooling layer; and
a power supply module, the power supply module being mounted on the second outer surface, and the power supply module being adjacent to the power supply cooling layer and cooled by coolant in the power supply cooling layer, wherein the control box comprises:
a box body, the power supply cooling layer being disposed in the box body, and the power supply module being mounted in the box body; and
a water channel cover plate, the water channel cover plate being mounted in the box body and covering the power supply cooling layer, the water channel cover plate and the box body defining the transition section, the IGBT cooling layer being disposed in the water channel cover plate, and the IGBT module being mounted in the water channel cover plate,
wherein an application well is disposed on the water channel cover plate, the application well is in communication with the IGBT cooling layer, and the IGBT module extends into the IGBT cooling layer by using the application well,
wherein a mounting surface is disposed on a surface of the water channel cover plate facing away from the box body, the mounting surface surrounds the application well, and the IGBT module is mounted on the mounting surface, and
wherein the second outer surface comprises a plurality of shielding cavities, and each of the shielding cavities shares at least one side wall with a water channel of the power supply cooling layer.