| CPC H05K 7/20336 (2013.01) [H05K 7/2039 (2013.01); H05K 7/20309 (2013.01); H05K 7/20318 (2013.01)] | 19 Claims |

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1. A thermal ground plane comprising:
a first casing comprising:
a first bonding region extending around a periphery of the first casing;
a first non-folding region overlapping portions of the first bonding region;
a first folding region overlapping portions of the first bonding region and portions of the first non-folding region; and
a second casing comprising:
a second bonding region extending around a periphery of the second casing;
a second non-folding overlapping portions of the second bonding region;
a second folding region overlapping portions of the second bonding region and portions of the second non-folding region; and
wherein the first casing and the second casing are sealed together at the first bonding region and the second bonding region, and the first folding region and the second folding region are substantially aligned; and
a vapor structure disposed on at least a portion of the interior surface of the first casing within the first non-folding region; and
a liquid structure comprising a mesh and a plurality of arteries, the plurality of arteries are formed within the mesh extending substantially parallel with a length of the thermal ground plane and extending substantially through the second folding region;
wherein at least a subset of the plurality of arteries has a length that is longer than the length of the first folding region measured parallel with the length of the thermal ground plane.
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