US 12,464,674 B2
Heat dissipation apparatus and electronic device
Cheng Tao, Shenzhen (CN); Yalong Wang, Beijing (CN); Fan Liu, Shenzhen (CN); Shuai Li, Shenzhen (CN); and Xingang Yu, Beijing (CN)
Assigned to ZTE Corporation, Shenzhen (CN); and Institute of Spacecraft System Engineering, Beijing (CN)
Appl. No. 18/265,757
Filed by ZTE Corporation, Shenzhen (CN); and Institute of Spacecraft System Engineering, Beijing (CN)
PCT Filed Sep. 26, 2021, PCT No. PCT/CN2021/120765
§ 371(c)(1), (2) Date Jun. 7, 2023,
PCT Pub. No. WO2022/134706, PCT Pub. Date Jun. 30, 2022.
Claims priority of application No. 202011517457.1 (CN), filed on Dec. 21, 2020.
Prior Publication US 2024/0040743 A1, Feb. 1, 2024
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20254 (2013.01) 14 Claims
OG exemplary drawing
 
1. A heat dissipation apparatus, comprising:
a cooling component, comprising at least two cooling plates in which a flow channel for containing a working medium is arranged; and
a first tube, through which the at least two cooling plates are connected, allowing the flow channel of the at least two cooling plates to be communicated with each other, at least part of the first tube being an extendable corrugated tube;
a second tube; and
a third tube;
wherein, each of the at least two cooling plates is provided with a liquid inlet and a liquid outlet which are communicated with the flow channel, the second tube is arranged at the liquid inlet and the liquid outlet, respectively, and the at least two cooling plates are connected through the first tube and the second tube, and the first tube, the second tube, and the flow channel between the at least two cooling plates that are connected in parallel and adjacent to each other are connected to form a closed fluid loop, and the third tube is used to pump the working medium into the closed fluid loop.