US 12,464,672 B1
Hybrid immersion cooling system
Tikhon Suresh Pichai, Simpsonville, SC (US); My Dinh Truong, Pacifica, CA (US); Douglas James Asay, San Jose, CA (US); David Buck Mar, San Jose, CA (US); and Bhavin Raju Shah, Sunnyvale, CA (US)
Assigned to Equinix, Inc., Redwood City, CA (US)
Filed by Equinix, Inc., Redwood City, CA (US)
Filed on Mar. 30, 2023, as Appl. No. 18/193,432.
Claims priority of provisional application 63/362,182, filed on Mar. 30, 2022.
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20236 (2013.01) [H05K 7/2029 (2013.01); H05K 7/20409 (2013.01); H05K 7/20772 (2013.01); H05K 7/20809 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system, comprising:
a computing device comprising a chassis and one or more components;
an immersion box within the chassis of the computing device and surrounding the one or more components of the computing device, wherein the immersion box is filled with a fluid;
a chip assembly positioned within the immersion box, the chip assembly comprising:
at least one component of the one or more components of the computing device; and
a pressure chamber adjacent to the at least one component, wherein the pressure chamber is hermetically sealed and contains a fluid mixture configured to facilitate convective cooling of the chip assembly including the at least one component; and
a cooling chamber positioned within the immersion box and surrounding the pressure chamber,
wherein the immersion box comprises a cooling jacket positioned within walls of the immersion box, the cooling jacket configured to receive coolant from a cold coolant line and allow the coolant to flow through the cooling jacket to facilitate cooling of the one or more components within the immersion box, and
wherein the cooling chamber is in fluid communication with the cooling jacket.