US 12,464,669 B2
Electronic devices and methods of manufacturing electronic devices
Shaun Bowers, Gilbert, AZ (US); Pedro Joel Rivera-Marty, Chandler, AZ (US); Yoshio Matsuda, Hyogo (JP); and Koichi Minami, Fukui (JP)
Assigned to Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed on Jun. 1, 2023, as Appl. No. 18/204,871.
Claims priority of provisional application 63/448,241, filed on Feb. 24, 2023.
Prior Publication US 2024/0292547 A1, Aug. 29, 2024
Int. Cl. H05K 5/10 (2025.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01); H05K 3/40 (2006.01)
CPC H05K 5/10 (2025.01) [H05K 3/284 (2013.01); H05K 3/3421 (2013.01); H05K 3/4038 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a substrate structure, comprising:
a base comprising a top side and a bottom side;
a first lead; and
a flag comprising a top side, a bottom side, and a flag lead;
an electronic component comprising a top side and a bottom side, a first electrode at the bottom side of the electronic component, and second electrode at the top side of the electronic component;
an encapsulant contacting a lateral side of the electronic component and a lateral side of the base; and
a first interconnect in the encapsulant, coupled between the first electrode and the first lead;
wherein the second electrode is coupled with the flag lead via the base.