US 12,464,653 B2
Circuit board and electronic-component-equipped circuit board
Kenji Matsuda, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Aug. 3, 2023, as Appl. No. 18/229,717.
Application 18/229,717 is a continuation of application No. PCT/JP2022/005045, filed on Feb. 9, 2022.
Claims priority of application No. 2021-022289 (JP), filed on Feb. 16, 2021.
Prior Publication US 2023/0380075 A1, Nov. 23, 2023
Int. Cl. H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/30 (2006.01); H05K 3/46 (2006.01)
CPC H05K 3/4644 (2013.01) [H05K 1/0242 (2013.01); H05K 1/181 (2013.01); H05K 3/303 (2013.01); H05K 2201/09336 (2013.01); H05K 2201/09354 (2013.01); H05K 2201/10098 (2013.01); H05K 2203/1572 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A circuit board comprising:
a multilayer body including a plurality of insulator layers including a first insulator layer laminated in a vertical direction;
a plurality of electrodes including a signal electrode and provided at an upper main surface of the first insulator layer so as to be arranged in a transverse direction, at least a portion of each of the plurality of electrodes being exposed to outside from the circuit board;
a signal conductor layer provided at the multilayer body and located below the signal electrode; and
a first interlayer connection conductor and a second interlayer connection conductor extending through the first insulator layer in the vertical direction and electrically connecting the signal electrode and the signal conductor layer to each other; wherein
a plurality of mounting portions are located at the portions of the plurality of electrodes that are exposed to the outside from the circuit board;
the first interlayer connection conductor and the second interlayer connection conductor are electrically connected to the signal electrode so as not to overlap one of the plurality of mounting portions located at the signal electrode when viewed in the vertical direction;
the circuit board includes a mounting region including the plurality of electrodes and a line region connected to the mounting region and in which the signal conductor layer extends; and
a width of the multilayer body in the mounting region in a direction orthogonal or substantially orthogonal to a direction in which the signal conductor layer extends is larger than a width of the multilayer body in the line region in the direction orthogonal or substantially orthogonal to the direction in which the signal conductor layer extends.