| CPC H05K 1/182 (2013.01) [H01F 27/2804 (2013.01); H01F 27/323 (2013.01); H01F 41/041 (2013.01); H01F 41/122 (2013.01); H05K 1/115 (2013.01); H05K 3/10 (2013.01); H01F 2027/2809 (2013.01); H05K 2201/08 (2013.01); H05K 2201/1003 (2013.01)] | 21 Claims |

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1. A component carrier, comprising:
a stack comprising at least one electrically insulating layer structure;
a structured electrically conductive layer assembled to the stack,
wherein the structured electrically conductive layer comprises a first portion being patterned so that a discontinuous layer is formed as a patterned portion divided from a second portion of the structured electrically conductive layer, when observed along a cross section of the patterned portion,
wherein a part of the structured electrically conductive layer is configured as an inductive element; and
a magnetic matrix embedded in the stack,
wherein the magnetic matrix at least partially surrounds the inductive element,
wherein the second portion of the structured electrically conductive layer surrounds the magnetic matrix when observed along a cross section of the inductive element, and
wherein the magnetic matrix comprises:
(i) a first part on which the structured electrically conductive layer structure is formed and functions as the inductive element,
(ii) a second part at least partially filling a gap between the structured electrically conductive layer structure forming the inductive element, and
(iii) a third part covering the structured electrically conductive layer structure forming the inductive element; and
an extension of the first part of the magnetic matrix and the third part of the magnetic matrix in at least one of the directions of main extension of the stack is larger than an extension of the second part of the magnetic matrix in said direction.
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