US 12,464,647 B2
Triangular board assembly for solid state drive
John Hung, Vancouver (CA); Andrew Morning-Smith, Vancouver (CA); Kai-Uwe Schmidt, Vancouver (CA); Paul Gwin, Orangevale, CA (US); and Nan Allison Yao, Regina (CA)
Filed by SK Hynix NAND Product Solutions Corp., Rancho Cordova, CA (US)
Filed on Dec. 24, 2020, as Appl. No. 17/133,836.
Prior Publication US 2021/0120672 A1, Apr. 22, 2021
Int. Cl. H05K 1/14 (2006.01); H05K 1/02 (2006.01); H05K 7/20 (2006.01)
CPC H05K 1/148 (2013.01) [H05K 1/0203 (2013.01); H05K 7/2039 (2013.01); H05K 2201/046 (2013.01); H05K 2201/064 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10159 (2013.01)] 6 Claims
OG exemplary drawing
 
1. An electronic apparatus, comprising:
a main board comprising a first surface which extends between a first edge of the main board and a second edge of the main board, wherein the second edge is opposite the first edge, the first surface comprising a first portion which extends to the first edge, a second portion which extends to the second edge, and a third portion between the first portion and the second portion, wherein the first portion, the second portion, and the third portion are substantially equal in size;
a first wing board electrically coupled to the main board by a first flexible connector along the first edge, wherein the first wing board is disposed over the third portion, wherein the first flexible connector extends horizontally across the first portion to each of the first wing board and the first edge, and wherein the first wing board is arranged at a first angle that is non-parallel with respect to the main board,
a second wing board electrically coupled to the main board by a second flexible connector along the second edge, wherein the second wing board is disposed over the third portion, wherein the second flexible connector extends horizontally across the second portion to each of the second wing board and the second edge, and wherein the second wing board is arranged at a second angle that is non-parallel with respect to the main board; and
a substantially triangular thermally conductive support structure disposed over the third portion, wherein:
the substantially triangular thermally conductive support structure is not in contact with the first portion and the second portion,
the substantially triangular thermally conductive support structure is not in alignment with the first portion and the second portion when viewed in a direction perpendicular to the first surface of the main board, and
the substantially triangular thermally conductive support structure is in mechanical and thermal communication with respective first sides of each of the main board, the first wing board, and the second wing board.