| CPC H05K 1/144 (2013.01) [H05K 1/115 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10378 (2013.01)] | 20 Claims |
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1. An electronic device comprising:
a housing comprising a front surface, a rear surface that is opposite to the front surface, and a side surface enclosing an inner space between the front surface and the rear surface; and
a printed circuit board disposed within the inner space, wherein the printed circuit board comprises:
a plurality of circuit boards that are substantially parallel to one another and comprise one or more electrical elements; and
one or more interposers disposed between the plurality of circuit boards and connecting a pair of circuit boards, among the plurality of circuit boards, adjacent to each other in a height direction,
wherein the pair of circuit boards are separated from the one or more interposers by a gap, and one or more board through holes are formed in the height direction through at least one of the plurality of circuit boards,
wherein the one or more interposers comprise:
one or more via holes formed in the height direction through the one or more interposers;
a via disposed within the one or more via holes and configured to electrically connect the pair of circuit boards; and
one or more interposer through holes formed in the height direction through the one or more interposers and configured to respectively communicate with the one or more board through holes of the pair of circuit boards, and
wherein the printed circuit board further comprises a non-conductive filler disposed within the gap.
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