US 12,464,643 B2
Power module with a ceramic circuit carrier, a flexible circuit board and a temperature sensor
Sebastian Strache, Wannweil (DE); Christoph Friederich, Reutlingen (DE); Dominik Alexander Ruoff, St. Johann (DE); Frank Zander, Rottenburg am Neckar (DE); Tatiana Barsukova, Riederich (DE); and Tobias Zahn, Rottenburg (DE)
Assigned to ROBERT BOSCH GMBH, Stuttgart (DE)
Appl. No. 18/549,063
Filed by Robert Bosch GmbH, Stuttgart (DE)
PCT Filed Mar. 3, 2022, PCT No. PCT/EP2022/055358
§ 371(c)(1), (2) Date Sep. 5, 2023,
PCT Pub. No. WO2022/189241, PCT Pub. Date Sep. 15, 2022.
Claims priority of application No. 10 2021 202 197.2 (DE), filed on Mar. 8, 2021.
Prior Publication US 2024/0164014 A1, May 16, 2024
Int. Cl. H05K 1/11 (2006.01); H05K 1/03 (2006.01)
CPC H05K 1/0306 (2013.01) [H05K 1/118 (2013.01); H05K 2201/10151 (2013.01)] 11 Claims
OG exemplary drawing
 
11. A method for sensing a temperature of a power semiconductor switch, the method comprising:
introducing a heat loss generated by the power semiconductor switch into a ceramic circuit carrier integrally connected to the power semiconductor switch; and
conducting the introduced heat loss away from the power semiconductor switch transversely, in an electrically conductive layer connected to a ceramic layer of the circuit carrier in an area of the power semiconductor switch, and the heat loss is conducted in the electrically conductive layer to a flexible circuit board integrally connected to the electrically conductive layer, and is conducted through the flexible circuit board along a thickness extension of the flexible circuit board up to a temperature sensor soldered to the flexible circuit board.