US 12,464,641 B2
Trace arrangement for printed circuit board
Shadi Ebrahimi Asl, Cary, NC (US); Stephen Aubrey Scearce, Apex, NC (US); and Linda W. Scott, Winter Springs, FL (US)
Assigned to CISCO TECHNOLOGY, INC., San Jose, CA (US)
Filed by Cisco Technology, Inc., San Jose, CA (US)
Filed on May 8, 2023, as Appl. No. 18/313,910.
Prior Publication US 2024/0381526 A1, Nov. 14, 2024
Int. Cl. H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/10 (2006.01)
CPC H05K 1/0296 (2013.01) [H05K 1/038 (2013.01); H05K 3/10 (2013.01); H05K 2201/10734 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A printed circuit board (PCB), comprising:
a substrate composed of a fiber glass material woven together to create a fiber glass weave pattern;
a first trace comprising a first plurality of trace segments electrically coupled to one another, wherein the first plurality of trace segments comprises a first trace segment and a second trace segment fractionally offset from one another along an axis by a first distance that is less than a ball grid array (BGA) pitch of a BGA of the PCB, the BGA pitch being a separation distance along the axis between a center of a first via of the BGA and a center of a second via of the BGA, and wherein the first trace segment extends between the first via and the second via; and
a second trace comprising a second plurality of trace segments electrically coupled to one another, wherein the second plurality of trace segments comprises a third trace segment and a fourth trace segment fractionally offset from one another along the axis by a second distance that is less than the BGA pitch to extend the first plurality of trace segments and the second plurality of trace segments along corresponding layouts of the fiber glass weave pattern of the substrate, wherein the third trace segment extends alongside the first trace segment external to the first via and the second via.