US 12,464,634 B2
Component carrier with embedded component on stepped metal structure with continuously flat bottom surface in at least one horizontal dimension
Steve Hsu, Chongqing (CN); and Hans Park, Chongqing (CN)
Filed by AT&S (Chongqing) Company Limited, Chongqing (CN)
Filed on Sep. 29, 2022, as Appl. No. 17/936,692.
Claims priority of application No. 202111150053.8 (CN), filed on Sep. 29, 2021.
Prior Publication US 2023/0098587 A1, Mar. 30, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/34 (2006.01); H05K 3/38 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01)
CPC H05K 1/0207 (2013.01) [H05K 3/0032 (2013.01); H05K 3/3436 (2013.01); H05K 3/383 (2013.01); H05K 3/384 (2013.01); H01L 23/13 (2013.01); H01L 23/49844 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/1511 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/35121 (2013.01); H05K 2201/0373 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/09136 (2013.01); H05K 2201/10166 (2013.01); H05K 2203/0307 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A component carrier, comprising:
a stack comprising at least one electrically conductive layer structure, at least one electrically insulating layer structure and a cavity delimited at a bottom side at least partially by a top side of a stepped metal structure of the at least one electrically conductive layer structure; and
a component embedded in the cavity and arranged on the stepped metal structure;
wherein a bottom side of the stepped metal structure has a flat surface extending continuously along at least one horizontal direction;
wherein the stepped metal structure is an integral metal body;
wherein the stepped metal structure comprises an upper layer section and a lower layer section, the upper layer section having a different diameter than the lower layer section such that a step is formed at a vertical sidewall of the metal structure at an interface between the upper layer section and the lower layer section,
wherein a ratio between the diameter of the lower layer section and the diameter of the upper layer section is in a range from 70% to 90%.