US 12,464,274 B2
Cushion for wearable device
Ying Chen Cheng, Taichung (TW); Yu Lin Chu, Taichung (TW); Cheng Yu Tsai, Taichung (TW); and Hsin-Chu Lin, Taichung (TW)
Assigned to Merry Electronics(Shenzhen) Co., Ltd., ShenZhen (CN)
Filed by Merry Electronics(Shenzhen) Co., Ltd., ShenZhen (CN)
Filed on Sep. 7, 2023, as Appl. No. 18/463,283.
Prior Publication US 2025/0088782 A1, Mar. 13, 2025
Int. Cl. H04R 1/10 (2006.01)
CPC H04R 1/1008 (2013.01) [H04R 2201/10 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A cushion for a wearable device, comprising:
an outer cover layer, comprising:
a first base material; and
a heat conducting material and a first heat storage material, dispersed within the first base material, and enthalpy of the outer cover layer is less than or equal to 5 Joules/gram; and
an inner cushion, comprising:
a second base material; and
a second heat storage material, dispersed within the second base material, wherein enthalpy of the inner cushion is greater than the enthalpy of the outer cover layer, and difference between the enthalpy of the inner cushion and the enthalpy of the outer cover layer is greater than 45 Joules/gram.