US 12,463,825 B2
Image processing apparatus and method
Yosuke Hiratsuka, Kanagawa (JP)
Assigned to Sony Group Corporation, Tokyo (JP)
Appl. No. 18/257,559
Filed by Sony Group Corporation, Tokyo (JP)
PCT Filed Oct. 28, 2021, PCT No. PCT/JP2021/039772
§ 371(c)(1), (2) Date Jun. 14, 2023,
PCT Pub. No. WO2022/137798, PCT Pub. Date Jun. 30, 2022.
Claims priority of provisional application 63/128,260, filed on Dec. 21, 2020.
Prior Publication US 2024/0113891 A1, Apr. 4, 2024
Int. Cl. H04L 9/40 (2022.01); G06T 7/55 (2017.01); G06V 20/00 (2022.01); H04L 9/32 (2006.01)
CPC H04L 9/3247 (2013.01) [G06T 7/55 (2017.01); G06V 20/95 (2022.01)] 24 Claims
OG exemplary drawing
 
1. An image processing apparatus comprising:
one or more processors;
an image acquisition unit that acquires an image of a subject by capturing an optical image from the subject;
a 3D information acquisition unit that acquires 3D information showing an unevenness of the subject from the optical image on a same optical axis as the image; and
a signature generation unit that generates a signature of the image and the 3D information, wherein
the image acquisition unit includes a pixel array in which pixels that photoelectrically convert light from the subject are arranged in a matrix, and
the 3D information acquisition unit includes a plurality of image plane phase difference detection pixels formed in the pixel array, and uses the image plane phase difference detection pixels to obtain information about a plurality of locations in the image acquired by the pixel array.