US 12,463,679 B2
Wireless device
Jaume Anguera Pros, Vinaros (ES); and Aurora Andujar Linares, Barcelona (ES)
Assigned to Ignion, S.L., Barcelona (ES)
Filed by IGNION, S.L., Barcelona (ES)
Filed on May 28, 2024, as Appl. No. 18/675,663.
Application 18/675,663 is a continuation of application No. 18/450,046, filed on Aug. 15, 2023, abandoned.
Application 18/450,046 is a continuation of application No. 18/087,315, filed on Dec. 22, 2022, abandoned.
Application 18/087,315 is a continuation of application No. 17/244,486, filed on Apr. 29, 2021, granted, now 11,563,461, issued on Jan. 24, 2023.
Application 17/244,486 is a continuation of application No. 16/160,613, filed on Oct. 15, 2018, granted, now 11,018,712, issued on May 25, 2021.
Application 16/160,613 is a continuation of application No. 15/404,969, filed on Jan. 12, 2017, granted, now 10,122,403, issued on Nov. 6, 2018.
Claims priority of provisional application 62/277,541, filed on Jan. 12, 2016.
Prior Publication US 2024/0396584 A1, Nov. 28, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H04B 1/40 (2015.01); H04B 1/3888 (2015.01)
CPC H04B 1/40 (2013.01) [H04B 1/3888 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A wireless device comprising:
a ground plane layer having a maximum size smaller than half of a longest free-space operating wavelength of the wireless device;
a boosting element having a largest dimension smaller than ⅙ times the longest free-space operating wavelength; and
a radiofrequency system comprising a tunable reactive circuit including: a switch connected between the boosting element and a transceiver, and a bank of fixed matching networks,
wherein at least a portion of an orthogonal projection of the boosting element onto a plane containing the ground plane layer overlaps the ground plane layer.