US 12,463,498 B2
Circuit connection device, rotating electric device, and circuit connection device manufacturing method
Junya Suzuki, Tokyo (JP); Yoshihiko Onishi, Tokyo (JP); and Isao Sonoda, Tokyo (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Appl. No. 18/290,387
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
PCT Filed Jul. 28, 2021, PCT No. PCT/JP2021/027826
§ 371(c)(1), (2) Date Nov. 13, 2023,
PCT Pub. No. WO2023/007598, PCT Pub. Date Feb. 2, 2023.
Prior Publication US 2024/0258872 A1, Aug. 1, 2024
Int. Cl. H02K 5/22 (2006.01); H01R 12/58 (2011.01)
CPC H02K 5/225 (2013.01) [H01R 12/585 (2013.01); H01R 2201/10 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A circuit connection device comprising:
a connector having connection terminals that are connected to an outside of the circuit connection device, and press-fit terminals that are connected to the connection terminals;
a circuit board that has terminal through holes formed, and the press-fit terminals are press-inserted into the terminal through holes;
a terminal alignment member having a terminal guide that has guide through holes formed, where the guide through holes guide the press-fit terminals towards the terminal through holes, and the terminal alignment member is fixed to the circuit board while being disposed between the connector and the circuit board, and
a heat sink that has an opening which houses the terminal guide on an inside of the opening, and the opening penetrates from a first surface to a second surface, where the circuit board is fixed to the first surface, and the connector is connected to the second surface that is on an opposite side of the first surface, wherein
first positioning protrusions are formed on one of the connector or the heat sink, and first positioning recesses that mate with the first positioning protrusions are formed on the other of the connector or the heat sink,
second positioning protrusions are formed on one of the circuit board or the terminal alignment member, and second positioning recesses that mate with the second positioning protrusions are formed on the other of the circuit board or the terminal alignment member, and
third positioning protrusions are formed on one of the heat sink or the terminal alignment member, and third positioning recesses that mate with the third positioning protrusions are formed on the other of the heat sink or the terminal alignment member.