US 12,463,449 B2
Semiconductor device
Takeshi Seike, Kyoto (JP)
Assigned to Rohm Co., Ltd., Kyoto (JP)
Filed by ROHM CO., LTD., Kyoto (JP)
Filed on Dec. 22, 2023, as Appl. No. 18/394,415.
Claims priority of application No. 2022-210811 (JP), filed on Dec. 27, 2022.
Prior Publication US 2024/0213796 A1, Jun. 27, 2024
Int. Cl. H02J 7/34 (2006.01); H02H 9/04 (2006.01); H03K 5/22 (2006.01)
CPC H02J 7/345 (2013.01) [H02H 9/046 (2013.01); H03K 5/22 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a capacitor connection terminal configured to enable an external connection of a capacitor;
a charger configured to charge the capacitor;
an ESD protector connected to the capacitor connection terminal; and
a current injector including a same component which is the same as the ESD protector and is configured to inject a current based on a leakage current flowing through the same component into a charging path where charging is performed by the charger.