| CPC H01S 5/168 (2013.01) [H01S 5/2206 (2013.01); H01S 5/2226 (2013.01); H01S 5/2232 (2013.01)] | 9 Claims |

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1. Diode laser, comprising:
an n-substrate made of an n-doped material;
an n-cladding layer made of an n-doped material disposed on the n-substrate;
an n-waveguide layer made of an n-doped material disposed on the n-cladding layer;
an active layer disposed on the n-waveguide layer;
a p-waveguide layer made of a p-doped material disposed on the active layer;
a p-cladding layer made of a p-doped material disposed on the p-waveguide layer;
a p-contact layer made of a p-doped material disposed on the p-cladding layer; and
a p-contact disposed on the p-contact layer;
wherein the diode laser comprises a layered current block made of a material doped in opposition to its surroundings for a spatially selective current injection of the active layer between the n-substrate and the p-contact;
wherein the current block is separated from adjacent layers via an intrinsic outer layer, wherein the thickness of the intrinsic outer layer is between 5 nm and 50 nm, wherein the current block comprises a first layer having a first thickness and a second layer disposed on the first layer having a second thickness greater than the first thickness, and wherein the sum of the thicknesses of the first layer and the second layer is between 5 nm and 100 nm.
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