US 12,463,357 B1
Solderless wire connector
John E. Klein, Chandler, AZ (US); and Jeffrey P. Baldwin, Anthem, AZ (US)
Assigned to Titan3 Technology LLC, Tempe, AZ (US)
Filed by Titan3 Technology LLC, Tempe, AZ (US)
Filed on Jan. 22, 2024, as Appl. No. 18/419,181.
Application 18/419,181 is a continuation of application No. 17/838,112, filed on Jun. 10, 2022, granted, now 12,003,068.
Application 17/838,112 is a continuation in part of application No. 17/695,775, filed on Mar. 15, 2022, granted, now 11,881,668.
Application 17/695,775 is a continuation of application No. 16/887,610, filed on May 29, 2020, granted, now 11,276,945, issued on Mar. 15, 2022.
This patent is subject to a terminal disclaimer.
Int. Cl. H01R 4/22 (2006.01)
CPC H01R 4/22 (2013.01) 20 Claims
OG exemplary drawing
 
1. A wire connector comprising:
an outer shell comprising a first end and a second end;
a wire cavity within the outer shell configured to threadedly couple to one or more wires; and
a plurality of raised ribs on a surface of the outer shell each raised rib of the plurality of raised ribs extending for a portion of a distance between the first end and the second end, wherein each raised rib of the plurality of raised ribs has a rib cap positioned on the raised rib and each rib cap is separated from an adjacent rib cap by a gap extending from the first end to the second end, and wherein each rib cap is separated from adjacent rib caps at the second end of the outer shell;
a plurality of channels individually defined between each raised rib of the plurality of raised ribs and an adjacent raised rib of the plurality of raised ribs, each channel of the plurality of channels having two side walls and a bottom wall,
wherein each rib cap is formed of a material more flexible than a material of the outer shell.