US 12,463,341 B2
Multi-band, shared-aperture, circularly polarized phased array antenna
Yujian Cheng, Chengdu (CN); Ruisen Hao, Chengdu (CN); Jinfan Zhang, Chengdu (CN); Zongrui He, Chengdu (CN); Tingjun Li, Chengdu (CN); Haining Yang, Chengdu (CN); Hongbin Wang, Chengdu (CN); Yong Fan, Chengdu (CN); Yafei Wu, Chengdu (CN); and Minghua Zhao, Chengdu (CN)
Assigned to University of Electronic Science and Technology of China, Chengdu (CN)
Filed by Univ. Electronic Science & Technology of China, Chengdu (CN)
Filed on Feb. 3, 2023, as Appl. No. 18/164,023.
Claims priority of application No. 202210508578.2 (CN), filed on May 11, 2022; and application No. 202210701549.8 (CN), filed on Jun. 21, 2022.
Prior Publication US 2023/0369760 A1, Nov. 16, 2023
Int. Cl. H01Q 9/04 (2006.01); H01Q 3/36 (2006.01); H01Q 21/00 (2006.01); H01Q 21/06 (2006.01)
CPC H01Q 3/36 (2013.01) [H01Q 9/0428 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A multi-band, shared-aperture, circularly polarized phased array antenna, comprising:
a dielectric substrate, a K-band metal patch array, a Ka-band metal patch array, a K-band filter and a Ka-band filter, wherein the dielectric substrate includes, in succession, a first metal ground, a first dielectric substrate layer, a second dielectric substrate layer, a second metal ground, a third dielectric substrate layer, a fourth dielectric substrate layer, a third metal ground, a fifth dielectric substrate layer, a fourth metal ground, a sixth dielectric substrate layer, a seventh dielectric substrate layer, a fifth metal ground, an eighth dielectric substrate layer, a ninth dielectric substrate layer, a tenth dielectric substrate layer and an eleventh dielectric substrate layer;
a ball grid array (BGA) configured to connect the first metal ground to an external surface or device;
a first metal via and a second metal via electrically connected to the first metal ground, wherein the fifth metal ground, the fourth metal ground, the third metal ground and the second metal ground are electrically connected by the first metal via, and the BGA, the fourth metal ground, the third metal ground and the second metal ground are electrically connected by the second metal via;
a Ka-band power divider comprising a first metal layer between the first dielectric substrate layer and the second dielectric substrate layer;
a third metal via and a fourth metal via electrically connected to the Ka-band power divider, wherein the Ka-band metal patch array is fed by the third metal via and is connected to the BGA by the fourth metal via;
a fifth metal via electrically connected to the third metal ground and the fourth metal ground;
a K-band feeder in the fourth metal ground;
a second metal layer on the third dielectric substrate layer, wherein the second metal via is electrically connected to the second metal layer; wherein:
the K-band metal patch array and the Ka-band metal patch array are on opposite surfaces of the tenth dielectric substrate layer, and the Ka-band metal patch array matches the K-band metal patch array; and
the third metal via connects the Ka-band metal patch with the Ka-band power divider.