| CPC H01Q 1/526 (2013.01) [H01Q 1/38 (2013.01)] | 6 Claims |

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1. A shield can disposed on an upper surface of a printed circuit board and configured to cover electronic components mounted on the printed circuit board, the shield can comprising:
a first slit formed in the shield can and dividing the shield can into a first internal region and a first external region spaced apart from the first internal region;
a shield region that is the first external region divided by the first slit;
a first radiation region that is the first internal region divided by the first slit;
a second slit spaced apart from the first slit, formed in the first external region, and dividing the first external region into a second internal region and a second external region spaced apart from the second internal region; and
a second radiation region that is the second internal region divided by the second slit,
wherein the first radiation region is formed in a meander line shape and resonates in a first frequency band, and
the second radiation region is formed in a patch shape and resonates in a second frequency band differing from the first frequency band.
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