US 12,463,321 B2
Antenna structure having a conductive layer, and an electronic device including same
Wonseob Kim, Suwon-si (KR); Byungjoon Kim, Suwon-si (KR); and Changwon Jang, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jul. 7, 2023, as Appl. No. 18/219,348.
Application 18/219,348 is a continuation of application No. PCT/KR2022/000002, filed on Jan. 3, 2022.
Claims priority of application No. 10-2021-0001766 (KR), filed on Jan. 7, 2021.
Prior Publication US 2023/0352810 A1, Nov. 2, 2023
Int. Cl. H01Q 1/22 (2006.01); H01Q 1/38 (2006.01); H01Q 21/06 (2006.01)
CPC H01Q 1/2283 (2013.01) [H01Q 1/38 (2013.01); H01Q 21/065 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An antenna structure comprising:
a printed circuit board (PCB);
a radio frequency integrated circuit (RFIC) disposed on a first surface of the PCB;
a first antenna disposed on a second surface of the PCB parallel to the first surface of the PCB, the first antenna comprising multiple conductive patches;
a dielectric layer disposed to be adjacent to the second surface of the PCB and parallel to the second surface of the PCB; and
a conductive layer disposed on the dielectric layer, the conductive layer comprising multiple openings formed in a region corresponding to the multiple conductive patches,
wherein the RFIC is configured to transmit/receive signals of a designated frequency through the first antenna and the conductive layer, wherein the signals of a designated frequency include a signal wavelength.