US 12,463,191 B2
Method for manufacturing electronic component device and electronic component device
Tomoaki Shibata, Tokyo (JP); Tsuyoshi Ogawa, Tokyo (JP); Satoshi Yoneda, Tokyo (JP); and Xinrong Li, Tokyo (JP)
Assigned to RESONAC CORPORATION, Tokyo (JP)
Appl. No. 17/612,321
Filed by Showa Denko Materials Co., Ltd., Tokyo (JP)
PCT Filed May 21, 2020, PCT No. PCT/JP2020/020132
§ 371(c)(1), (2) Date Nov. 18, 2021,
PCT Pub. No. WO2021/038986, PCT Pub. Date Mar. 4, 2021.
Claims priority of application No. 2019-156617 (JP), filed on Aug. 29, 2019.
Prior Publication US 2022/0246597 A1, Aug. 4, 2022
Int. Cl. H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 23/02 (2006.01); H01L 23/31 (2006.01)
CPC H01L 25/50 (2013.01) [H01L 23/02 (2013.01); H01L 23/31 (2013.01); H01L 24/11 (2013.01); H01L 24/12 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A method for manufacturing an electronic component device, the method comprising:
preparing a sealing structure comprising a sealing layer having two opposing main surfaces, an electronic component sealed in the sealing layer, and a connection portion connected to the electronic component, the connection portion being exposed on a circuit surface that is one main surface of the sealing layer;
preparing a rewiring structure comprising a rewiring portion having two opposing main surfaces, and a plurality of bumps provided on one main surface of the rewiring portion, the rewiring portion comprising rewiring connected to the plurality of bumps, and an insulating layer, wherein preparing the rewiring structure includes:
preparing a carrier base material comprising a support and a temporary fixing material layer provided on the support;
forming the rewiring portion on the temporary fixing material layer; and
forming the plurality of bumps connected to the rewiring on the main surface of the rewiring portion on a side opposite to the carrier base material; and then
bonding the sealing structure and the rewiring structure in a direction that the circuit surface and at least a part of the plurality of bumps face each other, with an insulating adhesive layer intervening between the sealing structure and the rewiring structure, such that the connection portion and at least a part of the plurality of bumps are connected, thereby forming a connected body comprising the sealing structure and the rewiring structure, the rewiring portion of the rewiring structure connected to the sealing structure comprising a protruding portion protruding to an outside from an end portion of the sealing structure;
forming an external sealing layer sealing the sealing structure on a surface of the connected body on a sealing structure side, the external sealing layer extending to a position on the protruding portion from a position on one of the main surfaces of the sealing structure on a side opposite to the rewiring structure; and
peeling off the carrier base material from the rewiring structure connected to the sealing structure.