| CPC H01L 24/81 (2013.01) [H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 2224/1308 (2013.01); H01L 2224/13123 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/13166 (2013.01); H01L 2224/13169 (2013.01); H01L 2224/1317 (2013.01); H01L 2224/13171 (2013.01); H01L 2224/13172 (2013.01); H01L 2224/13179 (2013.01); H01L 2224/13181 (2013.01); H01L 2224/81052 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81203 (2013.01); H01L 2924/01003 (2013.01); H01L 2924/01011 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01021 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01039 (2013.01); H01L 2924/0104 (2013.01); H01L 2924/01041 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01)] | 20 Claims |

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1. A reversable attachment system comprising:
an adhesion layer configured to attach to a first substrate;
an inter-substrate bond structure coupled to the adhesion layer;
a mating layer configured to attach to a second substrate; and
an extension actuator configured to attach to the second substrate and expand in response to an absorption of a gas,
wherein the inter-substrate bond structure is configured to form an initial thermocompression bond with the mating layer in response to an applied pressure and an applied heat, and the expansion of the extension actuator in response to absorbing the gas detaches the inter-substrate bond structure from the mating layer.
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