US 12,463,175 B2
Bonding with pre-deoxide process and apparatus for performing the same
Chen-Hua Yu, Hsinchu (TW); Ying-Jui Huang, Zhubei (TW); Chih-Hang Tung, Hsinchu (TW); Tung-Liang Shao, Hsinchu (TW); Ching-Hua Hsieh, Hsinchu (TW); Chien Ling Hwang, Hsinchu (TW); Yi-Li Hsiao, Hsinchu (TW); and Su-Chun Yang, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on May 23, 2022, as Appl. No. 17/664,484.
Application 17/664,484 is a division of application No. 16/264,957, filed on Feb. 1, 2019, granted, now 11,342,302.
Claims priority of provisional application 62/660,314, filed on Apr. 20, 2018.
Prior Publication US 2022/0285310 A1, Sep. 8, 2022
Int. Cl. H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 25/00 (2006.01)
CPC H01L 24/81 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4864 (2013.01); H01L 24/75 (2013.01); H01L 25/50 (2013.01); H01L 21/6838 (2013.01); H01L 2224/7501 (2013.01); H01L 2224/7565 (2013.01); H01L 2224/757 (2013.01); H01L 2224/81013 (2013.01); H01L 2224/81024 (2013.01); H01L 2224/8109 (2013.01); H01L 2224/81091 (2013.01); H01L 2224/812 (2013.01); H01L 2224/81908 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus configured to bond a first package component to a second package component, the apparatus comprising:
a pickup module configured to pick up the first package component;
a de-oxide module configured to remove an oxide layer from the first package component, wherein the de-oxide module comprises a plasma output device, and the plasma output device comprises:
a plasma channel;
an exhaust channel encircling the plasma channel; and
an inert gas channel encircling the exhaust channel;
an alignment module configured to align the first package component to the second package component; and
a placement module configured to place the first package component on the second package component.