US 12,463,174 B2
Method for bonding chips to a substrate by direct bonding
Frank Fournel, Grenoble (FR); Loic Sanchez, Grenoble (FR); and Brigitte Montmayeul, Grenoble (FR)
Assigned to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, Paris (FR)
Appl. No. 17/786,000
Filed by COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, Paris (FR)
PCT Filed Dec. 17, 2020, PCT No. PCT/EP2020/086664
§ 371(c)(1), (2) Date Jun. 16, 2022,
PCT Pub. No. WO2021/122909, PCT Pub. Date Jun. 24, 2021.
Claims priority of application No. 19 14956 (FR), filed on Dec. 19, 2019.
Prior Publication US 2023/0029338 A1, Jan. 26, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 24/80 (2013.01) [H01L 24/08 (2013.01); H01L 24/74 (2013.01); H01L 25/0655 (2013.01); H01L 2224/08221 (2013.01); H01L 2224/80004 (2013.01); H01L 2224/80085 (2013.01); H01L 2224/80395 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A process for bonding chips to a substrate by direct bonding, the bonding process comprising
providing a support comprising an adhesive film with which the chips are in contact, the chips in contact with the adhesive film being separate from one another,
forming a liquid film on one face of the substrate,
bringing the chips into contact with the liquid film, which action of bringing the chips into contact with the liquid film causes an attraction of the chips toward the substrate,
after bringing the chips in contact with the liquid film, separating the support from the adhesive film, the adhesive film remaining connected to the chips, and
evaporating the liquid film in order to bond the chips to the substrate by direct bonding.