| CPC H01L 23/66 (2013.01) [H01L 2223/6661 (2013.01)] | 11 Claims |

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1. A module comprising:
a substrate having an upper main surface and a lower main surface arranged in an up-down direction;
a metal member provided on the upper main surface of the substrate;
a first electronic component and a second electronic component mounted on the upper main surface of the substrate; and
a sealing resin layer provided on the upper main surface of the substrate and covering the metal member, the first electronic component, and the second electronic component, wherein
the metal member includes a plate-shaped portion and one or more foot portions,
the metal member is a rolled material,
the plate-shaped portion has a front main surface and a back main surface arranged in a front-back direction when viewed in the up-down direction,
the first electronic component is disposed in front of the metal member,
the second electronic component is disposed behind the metal member,
when viewed in the front-back direction, a line connecting a lower end of the plate-shaped portion in a left-right direction is defined as a lower side,
the one or more foot portions extend forward or backward from the lower side by bending the metal member at the lower side of the plate-shaped portion,
a plurality of rolling flaws extending in a predetermined direction are provided on the front main surface, the back main surface, an outer surface of a portion where the metal member is bent, and an inner surface of the portion where the metal member is bent, and
the outer surface of the portion where the metal member is bent is connected to the front main surface, and
surface roughness of the outer surface of the portion where the metal member is bent is smaller than surface roughness of the front main surface.
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