US 12,463,158 B2
Microelectronic device package with integral antenna module and semiconductor device
Vijaylaxmi Gumaste Khanolkar, Pune (IN); Anindya Poddar, Sunnyvale, CA (US); Hassan Omar Ali, Murphy, TX (US); Dibyajat Mishra, Plano, TX (US); Venkatesh Srinivasan, Plano, TX (US); and Swaminathan Sankaran, Allen, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on Jul. 29, 2022, as Appl. No. 17/877,426.
Prior Publication US 2024/0038691 A1, Feb. 1, 2024
Int. Cl. H01L 23/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01Q 1/22 (2006.01)
CPC H01L 23/66 (2013.01) [H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 23/49805 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01Q 1/2283 (2013.01); H01L 24/16 (2013.01); H01L 2223/6677 (2013.01); H01L 2223/6683 (2013.01); H01L 2223/6688 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/182 (2013.01); H01L 2924/2027 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a semiconductor device mounted to a device side surface of a package substrate, the package substrate having a board side surface opposite the device side surface;
an antenna module mounted to the package substrate via a solder ball, the antenna module coupled to the semiconductor device, the antenna module further comprising radiator elements formed of conductor material on one surface of a core, and comprising a ground plane reflector formed of the conductor material on an opposite surface of the core, and having dielectric material over the radiator elements and over the ground plane reflector; and
mold compound covering the semiconductor device, and a portion of the package substrate.