US 12,463,157 B2
Electronic package
Meng-Wei Hsieh, Kaohsiung (TW); Hung-Yi Lin, Kaohsiung (TW); Hsu-Chiang Shih, Kaohsiung (TW); and Cheng-Yuan Kung, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Dec. 30, 2021, as Appl. No. 17/566,569.
Prior Publication US 2023/0215822 A1, Jul. 6, 2023
Int. Cl. H01L 23/66 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 25/18 (2023.01); H03F 3/04 (2006.01)
CPC H01L 23/66 (2013.01) [H01L 23/3107 (2013.01); H01L 23/367 (2013.01); H01L 23/49811 (2013.01); H01L 25/18 (2013.01); H03F 3/04 (2013.01); H01L 2223/6655 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic package, comprising:
a first circuit layer having a first surface and a second surface opposite to the first surface;
an amplifier component connected to the first surface through a first conductive bump; and
a control component connected to the second surface of the first circuit layer through a second conductive bump;
wherein the control component is configured to transmit a first signal to the amplifier component and to output a second signal amplified by the amplifier component, and
wherein the first conductive bump and the second conductive bump are within a projection of the control component.