| CPC H01L 23/62 (2013.01) [H01L 23/051 (2013.01); H01L 23/562 (2013.01); H01L 25/072 (2013.01)] | 19 Claims |

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1. A semiconductor device, comprising:
a housing comprising: a first housing electrode and a second housing electrode arranged at opposite sides of the housing, and a tubular housing element arranged between the first and second housing electrodes and configured to electrically isolate the first and second housing electrodes from one another;
at least one semiconductor chip arranged within the housing between the first and second housing electrodes;
a first metal explosion shield arranged within the housing, wherein the first metal explosion shield is configured to extend into a space formed between the at least one semiconductor chip and the tubular housing element such that the first metal explosion shield surrounds the at least one semiconductor chip, wherein the first metal explosion shield comprises first and second opposite ends, and wherein the first end is a fixed end which is electrically coupled to the first housing electrode, and the second end is a free end which is spaced apart from the second housing electrode; and
a second metal explosion shield arranged within the housing and spaced apart from the first metal explosion shield, wherein the second metal explosion shield comprises third and fourth opposite ends, and wherein the third end is a fixed end which is electrically coupled to the second housing electrode, and the fourth end is a free end which is spaced apart from the first housing electrode.
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