US 12,463,150 B2
Bonding structures in semiconductor packaged device and method of forming same
Hao Chun Liu, Hsinchu (TW); Ching-Wen Hsiao, Hsinchu (TW); Kuo-Ching Hsu, Chung-Ho (TW); and Mirng-Ji Lii, Sinpu Township (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Apr. 17, 2024, as Appl. No. 18/637,539.
Application 17/813,069 is a division of application No. 16/265,136, filed on Feb. 1, 2019, granted, now 11,393,771, issued on Jul. 19, 2022.
Application 18/637,539 is a continuation of application No. 17/813,069, filed on Jul. 18, 2022, granted, now 11,990,428.
Claims priority of provisional application 62/737,531, filed on Sep. 27, 2018.
Prior Publication US 2024/0266304 A1, Aug. 8, 2024
Int. Cl. H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 23/58 (2006.01)
CPC H01L 23/562 (2013.01) [H01L 21/563 (2013.01); H01L 21/78 (2013.01); H01L 23/3185 (2013.01); H01L 23/585 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/13026 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/35121 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A device comprising:
a substrate, the substrate having a center region at an intersection of diagonals of the substrate in a plan view; and
a plurality of die structures attached to the substrate, each of the plurality of die structures comprising a plurality of connectors bonded to the substrate, each of the plurality of connectors having an elongated plan-view shape, a long axis of the elongated plan-view shape of each of the plurality of connectors being oriented toward the center region of the substrate, wherein the center region of the substrate is offset from at least one of the die structures of the plurality of die structures.