US 12,463,148 B2
Power semiconductor module with vibration dampeners and power electronics system including the power semiconductor module
Marco Bäßler, Oeversee (DE); and Michael Niendorf, Verl (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Feb. 8, 2023, as Appl. No. 18/107,257.
Prior Publication US 2024/0266300 A1, Aug. 8, 2024
Int. Cl. H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 25/07 (2006.01); H02M 7/00 (2006.01); H05K 1/18 (2006.01); H01L 23/40 (2006.01)
CPC H01L 23/562 (2013.01) [H01L 23/4952 (2013.01); H01L 23/49575 (2013.01); H01L 23/49861 (2013.01); H05K 1/18 (2013.01); H01L 23/3121 (2013.01); H01L 23/4006 (2013.01); H01L 2023/4087 (2013.01); H01L 24/48 (2013.01); H01L 25/0655 (2013.01); H01L 25/072 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48175 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09409 (2013.01); H05K 2201/1059 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A power semiconductor module, comprising:
an electrically insulative enclosure;
a plurality of power semiconductor dies attached to a substrate inside the electrically insulative enclosure;
a lead frame or clip frame disposed above the plurality of power semiconductor dies inside the electrically insulative enclosure and electrically connected to the plurality of power semiconductor dies;
a plurality of contact pins attached to the lead frame or clip frame and protruding through a first side of the electrically insulative enclosure to form an electrical connection interface outside the electrically insulative enclosure; and
a plurality of vibration dampeners attached to the lead frame or clip frame and protruding through the first side of the electrically insulative enclosure separate from the electrical connection interface,
wherein the plurality of vibration dampeners is configured to dampen vibrations at a circuit board designed to be mounted to the power semiconductor module and does not affect electrical operation of the power semiconductor module.
 
8. A power electronics system, comprising:
a power semiconductor module that includes an electrically insulative enclosure, a plurality of power semiconductor dies attached to a substrate inside the electrically insulative enclosure, a lead frame or clip frame disposed above the plurality of power semiconductor dies inside the electrically insulative enclosure and electrically connected to the plurality of power semiconductor dies, a plurality of pins attached to the lead frame or clip frame and protruding through a first side of the electrically insulative enclosure to form an electrical connection interface outside the electrically insulative enclosure, and a plurality of vibration dampeners attached to the lead frame or clip frame and protruding through the first side of the electrically insulative enclosure separate from the electrical connection interface; and
a circuit board that includes a plurality of electronic components mounted thereon, a plurality of first openings that receive the plurality of pins, and a plurality of second openings that receive the plurality of vibration dampeners,
wherein the plurality of vibration dampeners is configured to dampen vibrations at the circuit board and does not affect electrical operation of the power semiconductor module.