US 12,463,141 B2
Semiconductor substrate, semiconductor package, method of manufacturing the same
Wen Hung Huang, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Nov. 25, 2019, as Appl. No. 16/694,857.
Prior Publication US 2021/0159181 A1, May 27, 2021
Int. Cl. H01L 23/538 (2006.01); H01L 23/522 (2006.01)
CPC H01L 23/5389 (2013.01) [H01L 23/5222 (2013.01); H01L 23/5228 (2013.01); H01L 23/5383 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A semiconductor substrate, comprising:
lateral sides arranged along a plane; and
a plurality of electronic components;
wherein a total number of the electronic components is N, the electronic components are divided into M groups, M and N are positive integers, and M is smaller than N,
wherein the electronic components in each group are surrounded by sides of a first insulation layer to form a respective one of component modules, wherein each of the sides of the first insulating layer directly contacts the respective one of the electronic components with no layer therebetween; and
wherein each of the component modules is between two of the lateral sides, and a second insulation layer and surrounds the component modules, a first side of the second insulating layer directly contacts the first insulating layer with no layer therebetween, and a second side of the second insulating layer directly contacts one of the lateral sides with no layer therebetween.