US 12,463,130 B2
Wrap around metal via structure
Reinaldo Vega, Mahopac, NY (US); Nicholas Anthony Lanzillo, Wynantskill, NY (US); Albert M. Chu, Nashua, NH (US); Lawrence A. Clevenger, Saratoga Springs, NY (US); Ruilong Xie, Niskayuna, NY (US); and Brent A Anderson, Jericho, VT (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Nov. 18, 2022, as Appl. No. 17/989,932.
Prior Publication US 2024/0170392 A1, May 23, 2024
Int. Cl. H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01)
CPC H01L 23/5226 (2013.01) [H01L 23/528 (2013.01); H01L 23/53209 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A structure comprising:
a first metal level comprising a first metal line;
a second metal level spaced apart from the first metal level and comprising a second metal line; and
a first metal via structure connecting the first metal line to the second metal line, the first metal via structure comprises a first portion located between a first outermost sidewall and a second outermost sidewall of the second metal line and a second portion that extends beyond the first outermost sidewall or the second outermost sidewall of the second metal line, wherein the first metal via structure directly contacts a sidewall surface and a horizontal surface of the first metal line.