US 12,463,128 B2
Interconnect structures with vias having vertical and horizontal sections
Ruilong Xie, Niskayuna, NY (US); Lawrence A. Clevenger, Saratoga Springs, NY (US); Albert M. Chu, Nashua, NH (US); Brent A. Anderson, Jericho, VT (US); and Nicholas Anthony Lanzillo, Wynantskill, NY (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Aug. 1, 2022, as Appl. No. 17/878,270.
Prior Publication US 2024/0038656 A1, Feb. 1, 2024
Int. Cl. H01L 23/522 (2006.01); H01L 21/768 (2006.01)
CPC H01L 23/5226 (2013.01) [H01L 21/76816 (2013.01); H01L 21/76834 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A microelectronic structure, comprising:
a first interconnect line at a first interconnect level;
a second interconnect line at a second interconnect level; and
at least one via connecting the first interconnect line at the first interconnect level to the second interconnect line at the second interconnect level;
wherein the at least one via comprises a vertical section and at least one horizontal section, the at least one horizontal section being in contact with at least a portion of one of a top surface of the first interconnect line and a bottom surface of the second interconnect line.