US 12,463,127 B2
Integrated circuit (IC) package employing a re-distribution layer (RDL) substrate(s) with photosensitive dielectric layer(s) for increased package rigidity, and related fabrication methods
Yangyang Sun, San Diego, CA (US); Manuel Aldrete, Encinitas, CA (US); and Wei Wang, San Diego, CA (US)
Assigned to QUALCOMM INCORPORATED, San Diego, CA (US)
Filed by QUALCOMM Incorporated, San Diego, CA (US)
Filed on Jan. 17, 2023, as Appl. No. 18/155,398.
Prior Publication US 2024/0243056 A1, Jul. 18, 2024
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); H01L 25/10 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/49894 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 25/105 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/107 (2013.01); H01L 2225/1088 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/1511 (2013.01); H01L 2924/15174 (2013.01); H01L 2924/152 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A package-on-package, comprising:
a first die package, comprising:
a first substrate, comprising:
a first re-distribution layer (RDL) metallization layer, comprising:
a first photosensitive non-polymer dielectric material layer; and
a plurality of first metal interconnects disposed in the first photosensitive non-polymer dielectric material layer; and
a first die comprising a plurality of first die interconnects each coupled to a first metal interconnect of the plurality of first metal interconnects; and
a second die package, comprising:
a second substrate, comprising:
a second RDL metallization layer, comprising:
a second photosensitive non-polymer dielectric material layer; and
a plurality of second metal interconnects disposed in the second photosensitive non-polymer dielectric material layer; and
a second die comprising a plurality of second die interconnects each coupled to a second metal interconnect of the plurality of second metal interconnects;
wherein:
the first die package is coupled to the second die package; and
at least one second metal interconnect of the plurality of second metal interconnects is coupled to at least one first metal interconnect of the plurality of first metal interconnects.