US 12,463,121 B2
Structure to transition between a transmission line conductor and a solder ball
Ariel Greenbaum, Petah Tikva (IL); and Matan Pessach, Tel Aviv (IL)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 21, 2021, as Appl. No. 17/558,287.
Prior Publication US 2023/0197588 A1, Jun. 22, 2023
Int. Cl. H01L 23/498 (2006.01); G01S 7/03 (2006.01); H01L 23/66 (2006.01); H05K 1/18 (2006.01)
CPC H01L 23/49811 (2013.01) [G01S 7/032 (2013.01); H01L 23/66 (2013.01); H05K 1/181 (2013.01); H01L 2223/6605 (2013.01); H01L 2223/6677 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a semiconductor chip package substrate comprising a transmission line having a conductor to conduct current of a signal that is propagated along the transmission line, the conductor having an expanding width as the conductor approaches a vertical transition region, the vertical transition region between the conductor and a solder ball, the vertical transition region comprising multiple conducting vias at a same layer of the semiconductor chip package substrate, the multiple conducting vias electrically connected to the conductor, the multiple conducting vias radially arranged around a center axis of the solder ball.